The XH Instruments XHL-04XT multi-purpose bondtester is at the forefront of wafer testing technology catering for the testing of wafers，combining technology with the latest automation software delivers unparalleled accuracy, repeatability and results stability.

Principle:

Move the test head to the top of the test sample through the left and right joysticks. During the test, the Z -axis automatically moves down. When the test needle is touched to the surface of the test substrate, Z will stop moving after get signal, Z- axis will move up to the preset shear height . The Y -axis moves at a preset constant speed to perform shear test,  When the sample breaks, it automatically stops and the test data is displayed.

JEITA EIAJ ET-7407,  JEDEC JESD22-B117A, JEDEC JESD22-B11, JEDEC JESD22-B116, ASTM F1269, DT/NDT MIL STD 883, MIL STD 883§, MIL STD 883§ ,JEDEC JESD22-B109 ..etc